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Why I believe the new Mac Pro won't be a great machine for gaming

from Louwrentius - Solar [alt+shift+b] in technology

In Accidental Tech Podcast episode 18 (love the show), I learned that John Siracusa was thinking about buying a new Mac Pro for gaming. I believe that gaming on the new Mac Pro will be a mediocre experience. Driver support: as John mentioned himself, the video cards are 'professional GPUs' used in workstations for computing, CAD etc. These cards and especially their drivers under Windows are not geared towards gaming performance. The performance and quality of Mac OS X drivers may be improved dramatically over the past years, but if you like to play games exclusively under Windows, you will probably be disappointed when you switch to bootcamp. Crossfire support: you have these two ridiculously fast GPU's and for years on the PC platform, you can stack them together to achieve insane performance (SLI / Crossfire). Mac OS X does not seem to support crossfire (or SLI). If you can't benefit from crossfire, you're paying a lot of money for a machine with one idle but very expensive videocard. That sounds like a ridiculous waste of good money. Assuming that the hardware supports crossfire, if you would run Windows, then you may hit the driver issues associated with pro cards. Upgrading: upgrading can be cost-efficient as most games are GPU not CPU bound, not an option for the Mac Pro. Even the new Thunderbolt interface does not have sufficient bandwidth to hook up one or more external high-performance videocards, aside from the fact that this will be insanely expensive. If you really needs the horsepower of a Mac Pro for other purposes than for gaming, sure it's the fastest mac you can get, but otherwise, I believe there's a better deal to be had. We don't now what the new Mac Pro will cost in a configuration suitable for gaming, but it will be 'a lot'. I believe that for one new Mac Pro, you will also be able to buy: a mac Mini with reasonable specs (it's easy to replace memory and storage); a high-quality 27" display @ 2560x1440 a ridiculously fast PC that will...
22nd Jun 2013

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Bose SoundLink on-ear headphones battery replacement

Skip to the bottom two paragraph for instructions on how to replace the battery. I bought my Bose SoundLink on-ear Bluetooth headphones for 250 Euros around 2017 and I really like them. They are small, light, comfortable and can easily fit in a coat pocket when folded. Up until now (about 7 years later) I have replaced the ear cushions in 2019 (€25) and 2024 (€18). Early 2025, battery capacity had deteriorated to a point where it became noticeable. The battery was clearly dying. Unfortunately these headphones aren't designed for easy battery replacement: Bose hasn't published instructions on how to replace the battery, doesn't offer a replacement battery and hasn't documented which battery type/model is used. The left 'head phone' has two Torx security screws and most people won't have the appropriate screwdriver for this size There is soldering involved I wanted to try a battery replacement anyway as I hate to throw away a perfectly good, working product just because the battery has worn out. Maybe at some point the headband needs replacing, but with a fresh battery, these headphones can last another 7 years. Let's prevent a bit of e-waste with a little bit of cost and effort. Most of all, the cost of this battery replacement is much lower than a new pair of headphones as the battery was €18 including taxes and shipping. Right to repair should include easy battery replacement Although my repair seemed to have worked out fine, it requires enough effort that most people won't even try. For this reason, I feel that it should be mandatory by law that: Batteries in any product must be user-replaceable (no special equipment or soldering required) Batteries must be provided by the vendor until 10 years after the last day the product was sold (unless it's a standard format like AA(A) or 18650). Batteries must be provided at max 10% of the cost of the original product The penalty for non-compliance should be high enough such that it won't be regarded as the cost of doing business For that matter, all components that may wear down over time should be user-replaceable. What you need to replace the battery Buy the exact battery type: ahb571935pct-01 (350mAh) (notice the three wires!) A Philips #0 screwdriver / bit A Torx T6H security screwdriver / bit (iFixit kits have them) A soldering iron Solder Heat shrink for 'very thin wire' Multimeter (optional) a bit of tape to 'cap off' bare battery leads Please note that I found another battery ahb571935pct-03 with similar specifications (capacity and voltage) but I don't know if it will fit. Putting the headphone ear cushion back on can actually be the hardest part of the process, you need to be firm and this process is documented by Bose. Battery replacement steps I took Make sure you don't short the wires on the old or new battery during replacement The battery is located in the left 'head phone'. Use a multimeter to check if your new battery isn't dead (should be 3+ volt) Remove the ear cushion from the left 'head phone' very gently as not to tear the rim Remove the two philips screws that keep the driver (speaker) in place Remove the two Torx screws (you may have to press a bit harder) Remove the speaker and be carefull not to snap the wire Gently remove the battery from the 'head phone' Cut the wires close to the old battery (one by one!) and cover the wires on the battery to prevent a short Strip the three wires from the headphones a tiny bit (just a few mm) Put a short piece of heat shrink on each of the three wires of the battery Solder each wire to the correct wire in the ear cup Adjust the location of the heat shrink over the freshly soldered joint. Use the soldering iron close to the heat shrink to shrink it (don't touch anything), this can take some time, be patient Check that the heat shrink is fixed in place and can't move Put the battery into it's specific location in the back of the 'head phone' Test the headphones briefly before reassembling the headphones Reassemble the 'head phone' (consider leaving out the two Torx screws) Dispose of the old battery in a responsible manner

25th Feb 2025 • 71 votes
My 71 TiB ZFS NAS after 10 years and zero drive failures

My 4U 71 TiB ZFS NAS built with twenty-four 4 TB drives is over 10 years old and still going strong. Although now on its second motherboard and power supply, the system has yet to experience a single drive failure (knock on wood). Zero drive failures in ten years, how is that possible? Let's talk about the drives first The 4 TB HGST drives have roughly 6000 hours on them after ten years. You might think something's off and you'd be right. That's only about 250 days worth of runtime. And therein lies the secret of drive longevity (I think): Turn the server off when you're not using it. According to people on Hacker News I have my bearings wrong. The chance of having zero drive failures over 10 years for 24 drives is much higher than I thought it was. So this good result may not be related to turning my NAS off and keeping it off most off the time. My NAS is turned off by default. I only turn it on (remotely) when I need to use it. I use a script to turn the IoT power bar on and once the BMC (Baseboard Management Controller) is done booting, I use IPMI to turn on the NAS itself. But I could have used Wake-on-Lan too as an alternative. Once I'm done using the server, I run a small script that turns the server off, wait a few seconds and then turn the wall socket off. It wasn't enough for me to just turn off the server, but leave the motherboard, and thus the BMC powered, because that's just a constant 7 watts (about two Raspberry Pis at idle) being wasted (24/7). This process works for me because I run other services on low-power devices such as Raspberry Pi4s or servers that use much less power when idling than my 'big' NAS. This proces reduces my energy bill considerably (primary motivation) and also seems great for hard drive longevity. Although zero drive failures to date is awesome, N=24 is not very representative and I could just be very lucky. Yet, it was the same story with the predecessor of this NAS, a machine with 20 drives (1 TB Samsung Spinpoint F1s (remember those?)) and I also had zero drive failures during its operational lifespan (~5 years). The motherboard (died once) Although the drives are still ok, I had to replace the motherboard a few years ago. The failure mode of the motherboard was interesting: it was impossible to get into the BIOS and it would occasionally fail to boot. I tried the obvious like removing the CMOS battery and such but to no avail. Fortunately, the [motherboard]1 was still available on Ebay for a decent price so that ended up not being a big deal. ZFS ZFS worked fine for all these years. I've switched operating systems over the years and I never had an issue importing the pool back into the new OS install. If I would build a new storage server, I would definitely use ZFS again. I run a zpool scrub on the drives a few times a year2. The scrub has never found a single checksum error. I must have run so many scrubs, more than a petabyte of data must have been read from the drives (all drives combined) and ZFS didn't have to kick in. I'm not surprised by this result at all. Drives tend to fail most often in two modes: Total failure, drive isn't even detected Bad sectors (read or write failures) There is a third failure mode, but it's extremely rare: silent data corruption. Silent data corruption is 'silent' because a disk isn't aware it delivered corrupted data. Or the SATA connection didn't detect any checksum errors. However, due to all the low-level checksumming, this risk is extremely small. It's a real risk, don't get me wrong, but it's a small risk. To me, it's a risk you mostly care about at scale, in datacenters4 but for residential usage, it's totally reasonable to accept the risk3. But ZFS is not that difficult to learn and if you are well-versed in Linux or FreeBSD, it's absolutely worth checking out. Just remember! Sound levels (It's Oh So Quiet) This NAS is very quiet for a NAS (video with audio). But to get there, I had to do some work. The chassis contains three sturdy 12V fans that cool the 24 drive cages. These fans are extremely loud if they run at their default speed. But because they are so beefy, they are fairly quiet when they run at idle RPM5, yet they still provide enough airflow, most of the time. But running at idle speeds was not enough as the drives would heat up eventually, especially when they are being read from / written to. Fortunately, the particular Supermicro motherboard I bought at the time allows all fan headers to be controlled through Linux. So I decided to create a script that sets the fan speed according to the temperature of the hottest drive in the chassis. I actually visited a math-related subreddit and asked for an algorithm that would best fit my need to create a silent setup and also keep the drives cool. Somebody recommended to use a "PID controller", which I knew nothing about. So I wrote some Python, stole some example Python PID controller code, and tweaked the parameters to find a balance between sound and cooling performance. The script has worked very well over the years and kept the drives at 40C or below. PID controllers are awesome and I feel it should be used in much more equipment that controls fans, temperature, and so on, instead of 'dumb' on/of behaviour or less 'dumb' lookup tables. Networking I started out with quad-port gigabit network controllers and I used network bonding to get around 450 MB/s network transfer speeds between various systems. This setup required a ton of UTP cables so eventually I got bored with that and I bought some cheap Infiniband cards and that worked fine, I could reach around 700 MB/s between systems. As I decided to move away from Ubuntu and back to Debian, I faced a problem: the Infiniband cards didn't work anymore and I could not figure out how to fix it. So I decided to buy some second-hand 10Gbit Ethernet cards and those work totally fine to this day. The dead power supply When you turn this system on, all drives spin up at once (no staggered spinup) and that draws around 600W for a few seconds. I remember that the power supply was rated for 750W and the 12 volt rail would have been able to deliver enough power, but it would sometimes cut out at boot nonetheless. UPS (or lack thereof) For many years, I used a beefy UPS with the system, to protect against power failure, just to be able to shutdown cleanly during an outage. This worked fine, but I noticed that the UPS used another 10+ watts on top of the usage of the server and I decided it had to go. Losing the system due to power shenanigans is a risk I accept. Backups (or a lack thereof) My most important data is backed up trice. But a lot of data stored on this server isn't important enough for me to backup. I rely on replacement hardware and ZFS protecting against data loss due to drive failure. And if that's not enough, I'm out of luck. I've accepted that risk for 10 years. Maybe one day my luck will run out, but until then, I enjoy what I have. Future storage plans (or lack thereof) To be frank, I don't have any. I built this server back in the day because I didn't want to shuffle data around due to storage space constraints and I still have ample space left. I have a spare motherboard, CPU, Memory and a spare HBA card so I'm quite likely able to revive the system if something breaks. As hard drive sizes have increased tremendously, I may eventually move away from the 24-drive bay chassis into a smaller form-factor. It's possible to create the same amount of redundant storage space with only 6-8 hard drives with RAIDZ2 (RAID 6) redundancy. Yet, storage is always expensive. But another likely scenario is that in the coming years this system eventually dies and I decide not to replace it at all, and my storage hobby will come to an end. I needed the same board, because the server uses four PCIe slots: 3 x HBA and 1 x 10Gbit NIC. ↩ It takes ~20 hours to complete a scrub and it uses a ton of power while doing so. As I'm on a dynamic power tariff, I run it on 'cheap' days. ↩ every time I listen to ZFS enthusiasts you get the impression you are taking insane risks with your data if you don't run ZFS. I disagree, it all depends on context and circumstances. ↩ enterprise hard drives used in servers and SANs had larger sector sizes to accommodate even more checksumming data to prevent against silent data corruption. ↩ Because there is little airflow by default, I had to add a fan to cool the four PCIe cards (HBA and networking) or they would have gotten way too hot. ↩

14th Sep 2024 • 52 votes
The Raspberry Pi 5 is no match for a tini-mini-micro PC

I've always been fond of the idea of the Raspberry Pi. An energy efficient, small, cheap but capable computer. An ideal home server. Until the Pi 4, the Pi was not that capable, and only with the relatively recent Pi 5 (fall 2023) do I feel the Pi is OK performance wise, although still hampered by SD card performance1. And the Pi isn't that cheap either. The Pi 5 can be fitted with an NVME SSD, but for me it's too little, too late. Because I feel there is a type of computer on the market, that is much more compelling than the Pi. I'm talking about the tinyminimicro home lab 'revolution' started by servethehome.com about four years ago (2020). A 1L mini PC (Elitedesk 705 G4) with a Raspberry Pi 5 on top During the pandemic, the Raspberry Pi was in short supply and people started looking for alternatives. The people at servethehome realised that these small enterprise desktop PCs could be a good option. Dell (micro), Lenovo (tiny) and HP (mini) all make these small desktop PCs, which are also known as 1L (one liter) PCs. These Mini PC are not cheap2 when bought new, but older models are sold at a very steep discount as enterprises offload old models by the thousands on the second hand market (through intermediates). Although these computers are often several years old, they are still much faster than a Raspberry Pi (including the Pi 5) and can hold more RAM. I decided to buy two HP Elitedesk Mini PCs to try them out, one based on AMD and the other based on Intel. The Hardware Elitedesk Mini G3 800 Elitedesk Mini G4 705 CPU Intel i5-6500 (65W) AMD Ryzen 3 PRO 2200GE (35W) RAM 16 GB (max 32 GB) 16 GB (max 32 GB) HDD 250 GB (SSD) 250 GB (NVME) Network 1Gb (Intel) 1Gb (Realtek) WiFi Not installed Not installed Display 2 x DP, 1 x VGA 3 x DP Remote management Yes No Idle power 4 W 10 W Price €160 €115 The AMD-based system is cheaper, but you 'pay' in higher idle power usage. In absolute terms 10 watt is still decent, but the Intel model directly competes with the Pi 5 on idle power consumption. Elitedesk 705 left, Elitedesk 800 right (click to enlarge) Regarding display output, these devices have two fixed displayport outputs, but there is one port that is configurable. It can be displayport, VGA or HDMI. Depending on the supplier you may be able to configure this option, or you can buy them separately for €15-€25 online. Click on image for official specs in PDF format Both models seem to be equipped with socketed CPUs. Although options for this formfactor are limited, it's possible to upgrade. Comparing cost with the Pi 5 The Raspberry Pi 5 with (max) 8 GB of RAM costs ~91 Euro, almost exactly the same price as the AMD-based mini PC3 in its base configuration (8GB RAM). Yet, with the Pi, you still need: power supply (€13) case (€11) SD card or NVME SSD (€10-€45) NVME hat (€15) (optional but would be more comparable) It's true that I'm comparing a new computer to a second hand device, and you can decide if that matters in this case. With a complete Pi 5 at around €160 including taxes and shipping, the AMD-based 1L PC is clearly the cheaper and still more capable option. Comparing performance with the Pi 5 The first two rows in this table show the Geekbench 6 score of the Intel and AMD mini PCs I've bought for evaluation. I've added the benchmark results of some other computers I've access to, just to provide some context. CPU Single-core Multi-core AMD Ryzen 3 PRO 2200GE (32W) 1148 3343 Intel i5-6500 (65W) 1307 3702 Mac Mini M2 2677 9984 Mac Mini i3-8100B 1250 3824 HP Microserver Gen8 Xeon E3-1200v2 744 2595 Raspberry Pi 5 806 1861 Intel i9-13900k 2938 21413 Intel E5-2680 v2 558 5859 Sure, these mini PCs won't come close to modern hardware like the Apple M2 or the intel i9. But if we look at the performance of the mini PCs we can observe that: The Intel i5-6500T CPU is 13% faster in single-core than the AMD Ryzen 3 PRO Both the Intel and AMD processors are 42% - 62% faster than the Pi 5 regarding single-core performance. Storage (performance) If there's one thing that really holds the Pi back, it's the SD card storage. If you buy a decent SD card (A1/A2) that doesn't have terrible random IOPs performance, you realise that you can get a SATA or NVME SSD for almost the same price that has more capacity and much better (random) IO performance. With the Pi 5, NVME SSD storage isn't standard and requires an extra hat. I feel that the missing integrated NVME storage option for the Pi 5 is a missed opportunity that - in my view - hurts the Pi 5. Now in contrast, the Intel-based mini PC came with a SATA SSD in a special mounting bracket. That bracket also contained a small fan(1) to keep the underlying NVME storage (not present) cooled. There is a fan under the SATA SSD (click to enlarge) The AMD-based mini PC was equipped with an NVME SSD and was not equipped with the SSD mounting bracket. The low price must come from somewhere... However, both systems have support for SATA SSD storage, an 80mm NVME SSD and a small 2230 slot for a WiFi card. There seems no room on the 705 G4 to put in a small SSD, but there are adapters available that convert the WiFi slot to a slot usable for an extra NVME SSD, which might be an option for the 800 G3. Noice levels (subjective) Both systems are barely audible at idle, but you will notice them (if you sensitive to that sort of thing). The AMD system seems to become quite loud under full load. The Intel system also became loud under full load, but much more like a Mac Mini: the noise is less loud and more tolerable in my view. Idle power consumption Elitedesk 800 (Intel) I can get the Intel-based Elitedesk 800 G3 to 3.5 watt at idle. Let that sink in for a moment. That's about the same power draw as the Raspberry Pi 5 at idle! Just installing Debian 12 instead of Windows 10 makes the idle power consumption drop from 10-11 watt to around 7 watt. Then on Debian, you: run apt install powertop run powertop --auto-tune (saves ~2 Watt) Unplug the monitor (run headless) (saves ~1 Watt) You have to put the powertop --auto-tune command in /etc/rc.local: #!/usr/bin/env bash powertop --auto-tune exit 0 Then apply chmod +x /etc/rc.local So, for about the same idle power draw you get so much more performance, and go beyond the max 8GB RAM of the Pi 5. Elitedesk 705 (AMD) I managed to get this system to 10-11 watt at idle, but it was a pain to get there. I measured around 11 Watts idle power consumption running a preinstalled Windows 11 (with monitor connected). After installing Debian 12 the system used 18 Watts at idle and so began a journey of many hours trying to solve this problem. The culprit is the integrated Radeon Vega GPU. To solve the problem you have to: Configure the 'bios' to only use UEFI Reinstall Debian 12 using UEFI install the appropriate firmware with apt install firmware-amd-graphics If you boot the computer using legacy 'bios' mode, the AMD Radeon firmware won't load no matter what you try. You can see this by issuing the commands: rmmod amdgpu modprobe amdgpu You may notice errors on the physical console or in the logs that the GPU driver isn't loaded because it's missing firmware (a lie). This whole process got me to around 12 Watt at idle. To get to ~10 Watts idle you need to do also run powertop --auto-tune and disconnect the monitor, as stated in the 'Intel' section earlier. Given the whole picture, 10-11 Watt at idle is perfectly okay for a home server, and if you just want the cheapest option possible, this is still a fine system. KVM Virtualisation I'm running vanilla KVM (Debian 12) on these Mini PCs and it works totally fine. I've created multiple virtual machines without issue and performance seemed perfectly adequate. Boot performance From the moment I pressed the power button to SSH connecting, it took 17 seconds for the Elitedesk 800. The Elitedesk 705 took 33 seconds until I got an SSH shell. These boot times include the 5 second boot delay within the GRUB bootloader screen that is default for Debian 12. Remote management support Some of you may be familiar with IPMI (ILO, DRAC, and so on) which is standard on most servers. But there is also similar technology for (enterprise) desktops. Intel AMT/ME is a technology used for remote out-of-band management of computers. It can be an interesting feature in a homelab environment but I have no need for it. If you want to try it, you can follow this guide. For most people, it may be best to disable the AMT/ME feature as it has a history of security vulnerabilities. This may not be a huge issue within a trusted home network, but you have been warned. The AMD-based Elitedesk 705 didn't came with equivalent remote management capabilities as far as I can tell. Alternatives The models discussed here are older models that are selected for a particular price point. Newer models from Lenovo, HP and Dell, equip more modern processors which are faster and have more cores. They are often also priced significantly higher. If you are looking for low-power small formfactor PCs with more potent or customisable hardware, you may want to look at second-hand NUC formfactor PCs. Stacking multiple mini PCs The AMD-based Elitedesk 705 G4 is closed at the top and it's possible to stack other mini PCs on top. The Intel-based Elitedesk 800 G3 has a perforated top enclosure, and putting another mini pc on top might suffocate the CPU fan. As you can see, the bottom/foot of the mini PC doubles as a VESA mount and has four screw holes. By putting some screws in those holes, you may effectively create standoffs that gives the machine below enough space to breathe (maybe you can use actual standoffs). Evaluation and conclusion I think these second-hand 1L tinyminimicro PCs are better suited to play the role of home (lab) server than the Raspberry Pi (5). The increased CPU performance, the built-in SSD/NVME support, the option to go beyond 8 GB of RAM (up to 32GB) and the price point on the second-hand market really makes a difference. I love the Raspberry Pi and I still have a ton of Pi 4s. This solar-powered blog is hosted on a Pi 4 because of the low power consumption and the availability of GPIO pins for the solar status display. That said, unless the Raspberry Pi becomes a lot cheaper (and more potent), I'm not so sure it's such a compelling home server. This blog post featured on the front page of Hacker News. even a decent quality SD card is no match (in terms of random IOPs and sequential throughput) for a regular SATA or NVME SSD. The fact that the Pi 5 has no on-board NVME support is a huge shortcomming in my view. ↩ in the sense that you can buy a ton of fully decked out Pi 5s for the price of one such system. ↩ The base price included the external power brick and 256GB NVME storage. ↩

16th Jun 2024 • 110 votes
AI is critically important but not for you

Before Chat-GPT caused a sensation, big tech companies like Facebook and Apple were betting their future growth on virtual reality. But I'm convinced that virtual reality will never be a mainstream thing. If you ever used VR you know why: A heavy thing on your head that messes up your hair Nausea The focus on virtual reality felt like desperation to me. The desperation of big tech companies trying to find new growth, ideally a monopoly they control1, to satisfy the demands of shareholders. And then OpenAI dropped ChatGPT and all the big tech companies started to pivot so fast because in contrary to VR, AI doesn't involve making people nauseated and look silly. It's probably obvious that I feel it's not about AI itself. It is really about huge tech companies that have found a new way to sustain growth a bit longer, now that all other markets have been saturated. Flush with cash, they went nuts and bought up all the AI accelerator hardware2, which in turn uses unspeakable amounts of energy to train new large language models. Despite all the hype, current AI technology is at it's core a very sophisticated statistical model. It's all about probabilities, it can't actually reason. As I see it, work done by AI can't thus be trusted. Depending on the specific application, that may be less of an issue, but that is a fundamental limitation of current technology. And this gives me pause as it limits the application where it is most wanted: to control labour. To reduce the cost of headcount and to suppress wages. As AI tools become capable enough, it would be irresponsible towards shareholders not to pursue this direction. All this just to illustrate that the real value of AI is not for the average person in the street. The true value is for those bigger companies who can keep on growing, and the rest is just collateral damage. But I wonder: when the AI hype is over, what new hype will take it's place? I can't see it. I can't think of it. But I recognise that the internet created efficiencies that are convenient, yet social media weaponised this convenience to exploit our fundamental human weaknesses. As shareholder value rose, social media slowly chips away at the fabric of our society: trust. I've sold my Oculus Rift CV1 long ago, I lost hundreds of dollars of content but I refuse to create a Facebook/Meta account. ↩ climate change accelerators ↩

14th May 2024 • 47 votes
How to run victron veconfigure on a mac

Introduction Victron Multiplus-II inverter/charges are configured with the veconfigure1 tool. Unforntunately this is a Windows-only tool, but there is still a way for Apple users to run this tool without any problems. Tip: if you've never worked with the Terminal app on MacOS, it might not be an easy process, but I've done my best to make it as simple as I can. A tool called 'Wine' makes it possible to run Windows applications on MacOS. There are some caveats, but none of those apply to veconfigure, this tool runs great! I won't cover in this tutorial how to make the MK-3 USB cable work. This tutorial is only meant for people who have a Cerbo GX or similar device, or run VenusOS, which can be used to remotely configure the Multipluss device(s). Step 1: install brew on macos Brew is a tool that can install additional software Visit https://brew.sh and copy the install command open the Terminal app on your mac and paste the command now press 'Enter' or return It can take a few minutes for 'brew' to install. Step 2: install wine Enter the following two commands in the terminal: brew tap homebrew/cask-versions brew install --cask --no-quarantine wine-stable Download Victron veconfigure Visit this page Scroll to the section "VE Configuration tools for VE.Bus Products" Click on the link "Ve Configuration Tools" You'll be asked if it's OK to download this file (VECSetup_B.exe) which is ok Start the veconfigure installer with wine Open a terminal window Run cd Enter the command wine Downloads\VECSetup_B.exe Observe that the veconfigure Windows setup installer starts Click on next, next, install and Finish veconfigure will run for the first time Click on the top left button on the video to enlarge These are the actual install steps: How to start veconfigure after you close the app Open a terminal window Run cd Run cd .wine/drive_c/Program\ Files\ \(x86\)/VE\ Configure\ tools/ Run wine VEConfig.exe Observe that veconfigure starts Allow veconfigure access to files in your Mac Download folder Open a terminal window Run cd run cd .wine/drive_c/ run ls -n ~/Downloads We just made the Downloads directory on your Mac accessible for the vedirect software. If you put the .RSVC files in the Downloads folder, you can edit them. Please follow the instructions for remote configuration of the Multiplus II. Click on the "Ve Configuration Tools" link in the "VE Configuration tools for VE.Bus Products" section. ↩

4th Mar 2024 • 77 votes

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iPhone Duo early review

By a mile, the iPhone Duo has garnered more questions about what I think about it than any other phone I’ve ever had. It’s clearly a phone that has people intrigued, so I thought I’d jot down some loose, unorganized thoughts about what I think about it after about ten days. If I could sum all my thoughts up into one word, it’d simply be “fun”. I think for the vast majority of people, myself included, the iPhone 18 Pro is a more practical phone that through scientific analysis you’d likely even find a better phone. Even if they were priced the same, its package is more traditionally comfortable and ergonomic, with a better quality main camera, a helpful telephoto camera, a screen that’s more practical to use more of the time, a better biometric system (Face ID versus Touch ID) and a more established software experience. But damn if the iPhone Duo isn’t fun. Phones have been downright boring for so long. Incredible technology, lovely apps, but the hardware has been a bit slow moving since the iPhone X. Maybe that’s why I jumped onto the iPhone Air so readily. Even that slight departure from “black slab of glass” to “a dramatically thinner black slab of glass” was exciting versus what we’ve grown accustomed to. So I pick up the Duo, and it’s kinda just exciting to hold a phone for the first time in ages. Maybe that’s a honeymoon period and after a few months I’ll be over it. Maybe everyone who tries a folding phone for the first time experiences this. And to be clear, it’s not just all raw novelty. The fun aspect is fueled by having an absolutely incredible inner screen that fundamentally transforms what a phone is and can be. In addition, support the Apple Pencil has turned out to be phenomenally handy for me to be able to jot down quick thoughts and notes. For downsides, Touch ID is objectively worse than Face ID, but honestly, I don’t mind it as much as I expected I would. The smaller camera sensor than the Pro series phones is still decidedly great (rumors were it was a 17e size which was not correct, it’s the size of the normal 17’s). Software support gets better by the day, though iOS on the Duo is still decidedly a bit buggy at times. Other random thoughts Touch ID is objectively worse than Face ID, but honestly, I don’t mind it as much as I expected I would, previewing notifications is where I miss it the most After getting used to having a single speaker in the iPhone Air for a year, having stereo (not to mention great sounding) speakers is amazing The FaceTime camera on the inside is indeed not great for selfies/photography but honestly perfectly acceptable for FaceTime, and I’d definitely prefer this solution over a cutout on the inside so I’m happy! It definitely has a heavy feel to it, but it’s nothing honestly that bothersome A lot of the reviews said something to the effect of “the crease is practically invisible” and while I don’t really mind it or anything I definitely would disagree with that statement, you can see it a fair bit even with light content The hinge is a bit harder to open than I expected, I’ve found the secret is don’t pry from the middle of the side, instead put a thumb near the top and bottom (also helps prevent pressing Camera Control instead which I was doing all the time). I imagine this is necessary to have it be able to stop at arbitrary angles once open (which I do like) and hopefully it loosens up a bit with more use, but playing with Android foldables at Best Buy I did find their hinge easier to open I am really split on the inner, nano texture screen. It definitely helps reflections, has a neat look to it, and is super nice to draw on with the pencil, but it’s significantly less vibrant than the outer display which to my eyes looks a fair bit nicer. I think they made the right decision ultimately but it’s definitely not a zero-compromise solution. I was considering nano texture on my next MacBook but after this I think I’ll stick with glossy. My glass half full take with the Duo for now though is that we get two really cool screens to play with The outer screen is awesome for taking photos, unlike taller iPhones, your viewfinder fills the screen completely so it’s the largest feeling viewfinder I’ve used on a phone I miss the action button, nice little launcher for ChatGPT/Claude depending on which month it is Battery life is downright phenomenal versus my iPhone Air and 15 Pro (two devices admittedly not known for having great battery life) So, I don’t think the Duo is for most people who either don’t care much about phones, or care a lot about having the perfect phone, but for a decent amount of people in the middle I think the Duo represents a fundamentally different experience, that’s a ton of fun, and I’m excited to be excited about a phone again. (But, Apple, please figure out a way to add a telephoto lens.)

yesterday • 1 votes
Reverse engineering a vintage diode-transistor logic chip

Going through a collection of old parts, CuriousMarc encountered some ICs that he couldn't identify. He opened up one of these ICs, and I studied it under the microscope. After some reverse engineering, I determined that it was a logic chip that implemented four NAND gates using old-fashioned diode-transistor logic (DTL).1 The chip turned out to be the ST680A, a member of the Signetics 600 series of chips from 1965. In this article, I discuss the circuitry in this chip and how diode-transistor logic works. The die of the ST680A under the microscope. Integrated circuits can be packaged in many ways. One of the most popular is the plastic DIP (Dual In-line Package), a black rectangle of epoxy with two rows of metal pins. This type of package was invented by Signetics: "Introduced in late 1965, the 600 series was the first integrated circuit family to be offered in a solid, plastic, dual in-line package (DIP)." Earlier integrated circuits were packaged in round metal cans or in small flat-packs. In 1965, engineers at Fairchild invented the DIP, which had two rows of pins on 0.1" spacing. Unlike the surface-mounted flat-pack, the DIP had pins that were inserted into holes, making manual or automated assembly quick and easy. Because the pins of a DIP were on a regular grid, rather than the circular pattern of a metal can, circuit board design and manufacturing were also easier (details). The first DIP chips had ceramic packages. The plastic DIP, introduced by Signetics, was much cheaper and became very popular. An advertisement for the Signetics 600 series. From Electronics, March 21, 1966. The plastic DIP is less popular with me, however, because it is harder to open. With a ceramic package, I can simply tap it with a chisel and pop it open, but that doesn't work with epoxy packages. An epoxy package can be dissolved with nitric or sulfuric acid, but I try to avoid dangerous acids. Instead, CuriousMarc used Antoine's hot air decapping method. Unfortunately, the hot air technique doesn't always work. In this case, tiny bits of epoxy were stuck to the die, obscuring the circuitry. I used a few drops of boiling sulfuric acid to clean the die. (I'm okay with sulfuric acid in tiny quantities.) The die on its metal frame. The photo above shows the silicon die on its metal frame, the lead frame. The golden blobs are where the bond wires were attached to the die. You can see the doped silicon regions that form diodes and bipolar NPN transistors, as well as 16 resistors in the center, forming serpentine paths. Most chips have a passivation layer—a thin layer of silicon dioxide—over the chip. Inconveniently, this old chip didn't have a passivation layer, so the acid also stripped off the metal layer. (A few remnants are visible in the upper left.) Without the metal layer, I had to guess at how the components were connected to form logic gates. The die has very faint color differences where the silicon was protected by the metal, so that helped. Eventually, I came up with the diagram below, showing how the metal layer was probably configured. This wiring reveals that the chip implements four DTL NAND gates, which I'll describe in more detail below. One puzzle was that the chip has two unused diodes, indicated with question marks below. The metal layer for a quad NAND chip. I desaturated the image to make the labels clearer. Transistors, diodes, and resistors In this section, I'll explain how the patterns in the image correspond to components of the circuit. The silicon die is doped with various impurities to form regions with different electrical characteristics. These regions appear red or green under the microscope due to thin-film effects. As a result, the chip's transistors, diodes, and resistors are visible. The chip is made from bipolar NPN transistors, which have a completely different construction from the MOS transistors in modern ICs. In an NPN transistor, the current from the collector to the emitter is controlled by the current through the base. The collector is a large region of N-type silicon, silicon that is doped with atoms such as phosphorus or arsenic. Since these elements have one more valence electron than silicon, they give the silicon more negative charge carriers, so it is called N for negative. The N-type silicon happens to appear reddish. On top of the collector, the base is a thin region of P-type silicon, which appears green. This silicon has been doped with atoms such as boron or gallium, which have one fewer valence electron than silicon. The missing electrons form "holes", which act as positive charge carriers. Finally, the emitter is N-type silicon, on top of the base layer. These layers work together through semiconductor magic, amplifying the base current. Two NPN transistors on the chip. The second transistor is a larger output transistor. The chip's output transistors are slightly larger so they can sink more current. In the transistor on the right above, note that the collector contact wraps around three sides of the transistor. The emitter is also larger, with an L-shaped contact. According to the datasheet, each output transistor can sink 2.5 mA of current. The chip uses many diodes since it is diode-transistor logic. The structure of a diode is similar to a transistor, but without the emitter. In a diode, current flows from the cathode (P-type silicon) to the anode (N-type). A diode and a resistor on the chip. The chip uses 16 resistors, located in the middle of the die. A resistor is constructed from a long, thin region of doped silicon. Since silicon has moderately high resistance, a long strip of silicon acts as a resistor. Most of the resistors have a serpentine layout to fit a long resistor into a smaller area. These resistors consist of P-type silicon (green) in a "tub" of N-type silicon (red). The tub is connected to the positive voltage supply; since current doesn't flow from N-type silicon to P-type silicon, this isolates the resistors from each other. Operation of a DTL gate Logic gates can be created in many ways. The earliest integrated circuits (such as the ones in the Apollo Guidance Computer) used Resistor-Transistor Logic (RTL), where logic gates were constructed from resistors and transistors. In March 1962, Signetics announced the first family of commercial Diode-Transistor Logic (DTL) integrated circuits (details). By using diodes on the inputs instead of resistors, DTL provided better performance than RTL. However, DTL soon became overshadowed by TTL (Transistor-Transistor Logic), which was faster and used less power. (If you built digital circuits a few decades ago, you're probably familiar with the popular 7400 series of TTL chips.) The diagram below shows how the DTL NAND gate works. If both inputs are high, the current from the first resistor flows through the base of the first transistor, turning it on. The transistor amplifies this current, passing a much larger current from the transistor's collector to the transistor's emitter. This current goes through the base of the second transistor, which turns on the second transistor. The second transistor passes an even larger current from the output pin to ground, pulling the output pin low. The DTL NAND gate with both inputs high. The schematic is from the datasheet. This circuit is considerably more complicated than the DTL gate on Wikipedia. But if one of the input pins is pulled low, the current from the resistor goes through the diode instead of the transistor. The first transistor turns off, and without a base current, the second transistor turns off. The third resistor pulls the output high. Thus, the output is low only if both inputs are high: a NAND gate. The DTL NAND gate with an input low. I'll point out a few features of this circuit. The diodes on the inputs ensure that one input doesn't affect the other input. The diode in the middle raises the voltage on the first transistor's emitter, so it requires more voltage to turn on, reducing the sensitivity to noise. The output uses a resistor to pull the output high; more advanced circuits use another transistor. When the output is low, the third resistor is still "trying" to pull the output high, which is wasting power. Moreover, the resistor limits the output current, so the high output is fairly weak. In some DTL families, you can get gates with different values for the output resistor, so you can select the tradeoff between wasting power and having an output that is too weak. If you've used TTL integrated circuits from the 1970s, you know that chips usually have power and ground on diagonal pins: ground on pin 7 and power on pin 14. (Putting power and ground diagonally opposite both helps die layout and circuit board layout.) Much to my surprise, I found that the Signetics chips predate this standard and have ground on pin 1 and power on pin 8: still diagonal, but the wrong diagonal! The diagram below shows how the four NAND gates are wired in the chip. Pinout of the 680A quad NAND gate. From the databook. Three chips from one die When I examined the die under the microscope, I figured out the circuit, but I was puzzled by two extra diodes, as if two NAND gates had a third input that wasn't used. The explanation is that Signetics used the same silicon layout for at least three different chips, applying a different metal layer for different functionality. This saved money since it's much cheaper to produce a single optical mask for the metal layer than a complete set of new masks. Signetics sold semi-custom ICs to customers, using an approach called variFEBS (Variable Functional Electronics Blocks). This approach used a custom metal layer on top of fixed silicon, providing custom circuits without the cost of a full mask set. These circuits didn't sell well, but Signetics used the same approach for standard ICs. Pinout of the 670A triple NAND gate and the 616A quad NAND gate. All three chips have some similarities, such as using pins 2 and 14 as outputs. From the databook. One IC with the same silicon as the quad NAND gate is the 670A chip, which has three NAND gates, each with three inputs (above left). The diagram below shows how the silicon can be wired to provide this functionality. The hypothesized metal layer for the 670A triple-NAND gate. The layout for the triple chip above is a bit tricky because the top gate has inputs on both sides of the power (Vcc) pin. This creates a layout problem because the power and ground metal runs vertically to the resistors, blocking metal wiring from one side to the other. The solution is a "crossunder", a region of silicon that allows a signal to pass under the metal layer, connecting the inputs on the left to the rest of the circuitry on the right. This crossunder is visible near the top of the chip. Another chip with the same layout is the 616A dual NAND gate, with five inputs on each gate. Since this chip has 10 inputs in total (compared to 8 on the quad gate), this chip uses the two "extra" diodes that I spotted. If that isn't enough inputs, each NAND gate has an expansion input; by connecting external diodes to the expansion input, the gate can be made as large as desired. The hypothesized metal layer for the 616A dual-NAND chip. Some history The history of Signetics is closely tied to Fairchild. The story of Fairchild's founding is well known: in 1957, eight engineers—the Traitorous Eight—left Shockley Semiconductor and created Fairchild Semiconductor. Hundreds of companies (the "Fairchildren") were started by engineers who left Fairchild. Signetics was one of those companies, formed in 1961 and said to be the first company to exclusively design and manufacture integrated circuits.2 Signetics announced its first product in 1962, a NAND gate that cost $125 (over $1000 in current dollars).3 Not surprisingly, sales were weak. Signetics soon ran short of money, so in 1962, Corning Glass invested $1.7 million for 51% ownership of Signetics. Corning Glass may seem like a strange investor, but Corning was more of a high-tech company than you'd expect, making components such as resistors and glass capacitors, and later creating fiber optics. Moreover, in the early 1960s, integrated circuits were the hot area (much like AI now), and everyone wanted to get involved. In 1963, the Department of Defense pushed for contractors to use integrated circuits in new products. Riding this wave, Signetics became the leading producer of integrated circuits.4 However, Fairchild soon introduced a series of DTL chips that competed with Signetics. The Fairchild 930 series was faster than the Signetics chips and less than half the price, so Fairchild took much of the market from Signetics and dominated the IC market. Signetics also produced analog integrated circuits. Signetics is probably best known for creating the 555 timer chip in 1970, said to be the world's most popular IC, with billions sold.5 Signetics was acquired by Philips in 1975, and then Philips Semiconductors was spun off as NXP (Next exPerience) in 2006. NXP is currently the #10 semiconductor manufacturer worldwide, so the heritage of Signetics lives on. For more, follow me on Bluesky (@righto.com), Mastodon (@[email protected]), or RSS. Thanks to CuriousMarc for providing the IC and thanks to TubeTime for finding the databook. AI statement: Despite the presence of the em dash, no AI was used in the writing of this article (details). Notes and references After I had reverse-engineered the chip, TubeTime found datasheets for it, making my reverse engineering unnecessary. (See the Signetics Condensed Catalog 1969, Utilogic II Databook 1971, and Utilogic 2 Databook 1972.) We must have been unlucky with our original web searches since we didn't find anything. But this way you get to see what's inside the chip :-) The Signetics ST680A IC in its package. The large circular depression marks pin 1. From the date code, this chip is from 1971.  ↩ For more Signetics history, see Signetics Founding History, written by Lionel Kattner, a co-founder of Signetics. He states that the company name was inspired by the words "signals" and "networks", as well as the high-tech suffix "-netics". ↩ See History of Semiconductor Engineering, page 156. ↩ The book Making Silicon Valley describes the history of Signetics. It has a negative view of the Corning investment, saying that Signetics executives "Van Poppelen and Kattner dissented on the grounds that Corning was not a good fit for an integrated circuit company. In their view, Corning was a staid Eastern firm, ignorant about semiconductors and antithetic to the ways and culture of the electronics industry on the West Coast. Their view later proved to be correct." ↩ The 555 timer was created by analog IC wizard Hans Camenzind. If you're interested in analog circuits, you should read his book Designing Analog Chips, which you can download for free. ↩

yesterday • 1 votes
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3 days ago • 1 votes
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4 days ago • 1 votes
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